Government Regulations & Trends

International pressure to eliminate/reduce the use of lead in electronic assemblies is accelerating due to the European WEEE and RoHS regulations that will be effective 7/1/06. These efforts are having an increasing global impact as certain key Original Equipment Manufacturers (OEMs) begin transitioning their assemblies to lead-free for the European region.

Asia
The lead-free initiatives in the Japan OEM segment continue to be the most advanced in the industry. These OEMs are continuing to proliferate lead-free technology on new products throughout their manufacturing operations.

Europe
The confirmation of lead-free manufacturing techniques in Europe is reaching a very high level, and is more mature than in the North American market. Large Japanese OEMs in Europe are taking a leading role, and most PCBs assembled there will be affected by this strong movement.

North America
In the United States, the lead-free activity, although in its infancy, is accelerating due to a combination of environmental and competitive pressures in the industry. The global Japanese OEMs and elsewhere are also having an impact in the United States. For additional information, go to www.nemi.org

Other Regions
These markets are clearly waiting until lead-free technology and product demand have been developed in the larger markets.