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Lead-Free Technical Papers

Increase your lead-free knowledge by attending Cookson seminars and industry symposia presentations, and by refering to the technical paper section below.

General
Alloy Selection
A CE Benchmark Process For The Lead-Free Assembly Of Mixed Technology PCB's
CE Soldertec at ITRI Lead-Free Solder Recommendation
Development of a Lead-Free Wave Solder Alloy (IPC Frankfurt)
Ideals Project
Lead-Free Wave Solder Alloy Selection
Pad / Component Finish
CE Alternate Metal Finishes for Wire Bond and Soldering Applications
SMTAI 2002 Impact of Component Terminal Finishes
Reliability
CE Board Level Reliability of Lead-Free Packages
CE Impact of Intermetalic Growth on the Mechanical Strength of Lead-Free BGA Assemblies
Ideals Project
SMTAI 2001 Thermal Fatigue Resistance
PROCESS SPECIFIC - Hand Soldering / Rework
Rework Process
Ideals Project
Process Guidelines to LF Assembly -
PROCESS SPECIFIC - SMT Reflow
SMT Reflow Process
Ideals Project
Lead-Free Transition Checklist
Practical LF Implementation (APEX 2005)
Process Guidelines to LF Assembly -
Round Robin Testing and Analysis of Lead Free Solder Pastes with Alloys of Tin, Silver and Copper
Stencil Design
Optimizing Stencil Design for Lead-Free Processing (SMTA 2004)
Tombstoning
0201’S AND Tombstoning in Lead-Free Systems
Voiding
Effect of Lead-Free Assembly Processing on Solder Joint Voiding
Effect of Via Fill on Voiding
PROCESS SPECIFIC - Wave Solder Process
Copper Erosion
Wave Solder Process
CE Lead Free Wave Soldering Process
Development of a Lead-Free Wave Solder Alloy (IPC Frankfurt)
Ideals Project
Lead-Free Transition Checklist
Lead-Free Wave Solder Alloy Selection
Practical LF Implementation (APEX 2005)
Process Guidelines to LF Assembly -
Selection of Wave Soldering Fluxes for Lead Free Assembly