Epibond® 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications.

• Non-slumping and non-stringing.
• Room temperature stability.
• Dispense, print and pin transfer application.
• Consistent dot profile and fact curing.
• High-visibility red or yellow options.
• Screen printable with ALPHA CUT laser stencils to SMD adhesive guidelines.

Epibond®* 7275-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond® are high-quality non-slumping and non-stringing adhesives applied by dot dispensing, printing equipment and pin transfer, giving consistent dot profile and fast curing.

Epibond® Typical Cure Profile

A correct thermal profile is critical to ensure that the adhesive achieves maximum mechanical strength and a homogeneous cure:

• Ensure the material is heated to the correct temperature for the specific time.
• maximum thermal ramp rate is 1.5 to 2.0°C/second to ensure a homogeneous cure.

Printed Adhesive

Dispensed Adhesive

• Sales/support in every major electronics geographic market
• Local and consistent technical support regionally and globally
• Consistent product performance globally

Typical Properties