ALPHA WS-820 Water Soluble Solder Paste

ALPHA WS-820 is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead free alloy solder paste.

Product Documentation
Technical Bulletins
	ALPHA WS-820 Water Soluble Solder Paste Technical Bulletin (English)
	ALPHA WS-820 Water Soluble Solder Paste Technical Bulletin (Chinese)
Product Guide
	ALPHA WS-820 Water Soluble Solder Paste Product Guide (English)
Reference Bulletins
	Aperture Shapes Reference Bulletin (English)
	RB-Paste Labels & Packaging-CNP-WWE-SM000 05-06-21 Reference Bulletin (English)
	Stencil Terminology Reference Bulletin (English)
	Visual Inspection Standards Reference Bulletin (English)
	RB-Solder Paste Handling Guidelines AM-CNP-USE-SM000-1 08-06-27. Reference Bulletin (English)
Application Bulletins
	AB-Print Parameters-CNP-WWE-Print Parameters 06-03-02 Application Bulletin (English)
RoHS Declaration
	Material and Substances Declaration Alpha Solder Paste - WS820 SAC305.pdf RoHS Declaration (English)
	154227 - ALPHA CVP-360 Solder Paste SACX0307-GLB-RoHS-SP-124 RoHS Declaration (English)
	142511-ALPHA OM-6106 Solder Paste Sn63_Pb37-GLB-RoHS-SP-017 RoHS Declaration (English)
	143729-ALPHA OM-338 Solder Paste SAC305-GLB-RoHS-SP-001 RoHS Declaration (English)
	148968-ALPHA WS809 Solder Paste Sn63_Pb37-GLB-RoHS-SP-142 RoHS Declaration (English)
	153510 - ALPHA CVP-360 Solder Paste SACX Plus 0807-GLB-RoHS-SP-148 RoHS Declaration (English)
	143395-ALPHA OM-5100 Solder Paste 63Sn_37Pb-GLB-RoHS-SM-034 RoHS Declaration (English)
	149816 - ALPHA OM-350 Solder Paste 96.5SN_3.0AG_0.5CU _SAC305_-GLB-RoHS-SP-052 RoHS Declaration (English)
	128954 - ALPHA Solder SAC387 Alloy-GLB-RoHS-SM-77 RoHS Declaration (English)
	152567-ALPHA WB-7200 Solder Paste 96.5SN_3.0AG_0.5CU-RoHS-SP-147 RoHS Declaration (English)
	149281-ALPHA OM338-PT Solder Paste 96.5SN_3.0AG_0.5CU-RoHS-SP-145 RoHS Declaration (English)
	142745-ALPHA WS-709 Solder Paste 63Sn_37Pb Alloy-GLB-RoHS-SP-015 RoHS Declaration (English)
	144969-ALPHA OM338T Solder Paste SAC305-GLB-RoHS-SP-138 RoHS Declaration (English)
Technical Papers
	Fine Feature Print (APEX 2003) Technical Paper (English)
	High Density Fine Feature (APEX 2001) Technical Paper (English)
	New Dim In Stencil Print (SMTA 2002) Technical Paper (English)
	Print&Profile Fine Feature (APEX 2003) Technical Paper (English)
	Printing Tutorial (CSR April 2003) Technical Paper (English)
	Real Time Visualization (SMT Jan 2003) Technical Paper (English)
	Small Tapered Apertures (Nepcon 2002) Technical Paper (English)
	Solder Paste Qualification Paper Technical Paper (English)
	Stencil Desn for L-F (SMT2004) Technical Paper (English)
	Stencil Printing Basics (A. Johnson) Technical Paper (English)
	TP-Method of Eval ICT Probe Penetrability of Flux Residues (Apex 06)-CNP-WWE--SM000 06-01-02. Technical Paper (English)
	TP-Method of Eval ICT Probe Penetrability (Apex 06)-CNP-WWE-SM000 06-01-02 Technical Paper (English)
	iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry Technical Paper (English)
	Low silver BGA Paper Technical Paper (English)
	The Effect Of Filling Via-In-Pad On Voiding Rates In PWB Assembly For BGA Components Technical Paper (English)
	A new Angle on Printing Technical Paper (English)
	TP-Halogens in Lead Free Solder Paste (SMTA 2009)- WWE SM000 -4 10-04-15 Technical Paper (English)
	Analytical Proceedures for Portable L-F Alloy Test Data Technical Paper (English)
	SPVC-Portable Tests 510-CNP-WWE-SM00 10-08-03 Technical Paper (English)

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