Cookson Electronics Soldering Alloys Wave Solder Bar Search
Soldering Alloys
Soldering Alloys
Advanced Search
Alpha
Alpha

ALPHA Vaculoy SMG 63/37

Vacuoly SMG solder is alloyed in Alpha’s proprietary Vaculoy process utilizing materials of the lowest impurity levels available. This provides the basis for it to far exceed the requirements for solder set by J-STD-006 and previous military specification QQS-571F. In addition, Alpha’s unique Vaculoy process removes included oxides. Inspection of each lot of material by both chemical analysis and Dross Inclusion Tests guarantees consistency with regard to metallic and non-metallic impurities, including oxides.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.
Product Documentation
Technical Bulletins
PDF FileALPHA Vaculoy SMG 63/37 Technical Bulletin (English)
Reference Bulletins
Mixing Lead-Free Alloys in PCB Assembly Reference Bulletin (English)
Wetting Test SACX vs SAC0307 Reference Bulletin (English)
SACX Hole Fill Performance Reference Bulletin (English)
SACX Patent and Trademark Reference Bulletin (English)
Guidance on Wave set up to minimize dross Reference Bulletin (English)
Changing a Wave Solder bath from SAC305 to SACX Reference Bulletin (English)
SACX Anti-Oxidant Additive Reference Bulletin (English)
Changing Wave Solder bath from Sn-Pb to Lead-Free Reference Bulletin (English)
Lead-Free Alloys : Stainless Steel Erosion Reference Bulletin (English)
Mixing Lead-Free alloys in PCB Assembly Reference Bulletin (English)
Wave Goodbye to Inferior Yields Reference Bulletin (English)
Lead Free Solders - Lead Content Reference Bulletin (English)
Minimizing the risk of Pb Contaminatio Reference Bulletin (English)
Lead-Free Alloys : Impurity Action Levels Reference Bulletin (English)
Wetting Test SACX vs SAC0307 Reference Bulletin (English)
Guidance on Wave set up to minimize dross - Chinese Reference Bulletin (Chinese)
Wetting Test SACX vs SAC0307 - Chinese Reference Bulletin (Chinese)
SACX Hole Fill Performance - Chinese Reference Bulletin (Chinese)
Lead-Free Alloys : Impurity Action Levels : Chinese Reference Bulletin (Chinese)
Changing a Wave Solder bath from SAC305 to SACX - Chinese Reference Bulletin (Chinese)
Mixing Lead-Free alloys in PCB Assembly - Chinese Reference Bulletin (Chinese)
SACX Patent and Trademark - Chinese Reference Bulletin (Chinese)
Customer Letter - SACX Patent and Trademark - Chinese Reference Bulletin (Chinese)
Wechsel von SAC auf SACX Reference Bulletin (German)
Edelstahlkorrosion Reference Bulletin (German)
Mischen unterschiedlicher bleifreier Legierungen Reference Bulletin (German)
Auswahl bleifreier Legierungen Reference Bulletin (German)
Bleifreie Lote - Bleigehalt Reference Bulletin (German)
SACX HASL - Pentagal Report Reference Bulletin (English)
Technical Papers
Development of a L-F Wave Solder Alloy (Campbell-Ingham-B Technical Paper (English)
Lead-Free Wave Solder Alloy Selection Technical Paper (English)
TP-Effect of Voiding in Solder Interconnections (LF Technical Subcommittee)-Bar-WWE-SM000 05-12-01 Technical Paper (English)
Drop Shock Reliabilty of Lead-Free Alloys - Effect of Micro-Additives Technical Paper (English)
iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry Technical Paper (English)
Effect of Silver in Common Pb-free Alloys Technical Paper (English)
SPVC-Portable Tests 510-CNP-WWE-SM00 10-08-03 Technical Paper (English)
Press Releases
SACX Sales Growth (English)

 

Looking for a different product? Try our convenient Product Search Tool.

Alpha