The first product specifically developed to protect adjacent components during printed circuit board rework.

• CoolCap(TM) protects adjacent IC components from secondary solder joint reflow due to stray heat from the rework process
• CoolCap(TM) fits common BGA and QFP size packages specifically for rework operations
• CoolShield(TM) protects passives and odd shaped components against excessive heat that can compromise device reliability
• Compatible with both tin-lead and lead-free solder rework

- CoolCap Rework Demo Test Data
- CoolCap Rework Kits
- CoolCap Rework Presentation
- CoolCap Rework Features and Benefits
- CoolCap Rework Performance Examples: Tin-Lead
- CoolCap Rework Performance Examples: Lead-Free