CoolCap Features and Benefits

• Enables fast set up and high rework throughput and yield. All devices are reusable.
• Delivers repeatable performance.
• Provides up to 60°C temperature reduction for the adjacent component package body.
• Provides up to 35°C temperature reduction for the protected component solder joints.
• Prevents secondary reflow.
• Reduces the need for device-specific rework nozzles.
• Protects adjacent components from additional stray heat present with non-specific nozzles.
• Rests directly on the PCB, and does not require the use of adhesive or clean up.
• 1.5mm wall thickness allows fit despite close component placement.
• Eliminates undesirable temperature cycling of adjacent components.
• Compatible with Tin-Lead and Lead-Free rework processes.

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